Recess electrodepositing method, electrode assembly and apparatu

Details Recess electrodepositing method, electrode assembly and apparatu Recess electrodepositing method, electrode assembly and apparatu

1982-01-12

1983-09-20

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204222, 204DIG10, C25D 504, C25D 1710

Patent

active

044054114

ABSTRACT:
A method, electrode assembly and apparatus for forming an electrodeposited metallic layer on a wall of a recess in a workpiece and at least on a bottom area in the recess. The electrode assembly comprises an electrodepositing electrode element and a support member so formed as to incorporate the electrode element therein and have a surface contour complementary to a surface contour of the recess in the workpiece. The support comprises a porous mass composed at least in part of an electrically nonconductive material and having abrasive particles distributed therein at least on the contoured surface thereof. In operation, the assembly and the workpiece are positioned to establish a mating engagement of the support member with the recess and a liquid electrolyte is supplied onto the wall of the recess. The electrode assembly is reciprocated to cyclically bring the support member in pressure contact with and away from the surface of the recess while a depositing current is passed between the electrode element and the workpiece at least during a time period in which the support member and the surface of the recess are brought together to uniformly electrodeposit a metal from the liquid electrolyte on the wall and at least on the aforesaid bottom area in the recess.

REFERENCES:
patent: 3619384 (1971-11-01), Eisner
patent: 3706650 (1972-12-01), Eisner
patent: 3751346 (1973-08-01), Ellis
patent: 3922207 (1975-11-01), Towrey, Jr.

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