Rearrangement sheet, semiconductor device and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support

Reexamination Certificate

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C438S106000, C438S107000, C438S108000, C438S110000, C438S125000, C438S612000, C257S777000, C257SE21505, C257SE21705

Reexamination Certificate

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07435626

ABSTRACT:
There are provided a semiconductor device construction having more degrees of design freedom of the semiconductor element than prior arts, and a method of manufacturing such device easily and at low cost. For this purpose, a rearrangement sheet is employed provided with an insulating sheet and conductive metallic patterns formed on this insulating sheet.

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