Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2004-06-15
2008-10-14
Toledo, Fernando L. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S106000, C438S107000, C438S108000, C438S110000, C438S125000, C438S612000, C257S777000, C257SE21505, C257SE21705
Reexamination Certificate
active
07435626
ABSTRACT:
There are provided a semiconductor device construction having more degrees of design freedom of the semiconductor element than prior arts, and a method of manufacturing such device easily and at low cost. For this purpose, a rearrangement sheet is employed provided with an insulating sheet and conductive metallic patterns formed on this insulating sheet.
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Saeki Yoshihiro
Uchida Yasufumi
Oki Electric Industry Co. Ltd.
Rabin & Berdo PC
Stark Jarrett J
Toledo Fernando L.
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