Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2007-01-31
2008-10-14
Lauchman, L. G. (Department: 2877)
Optics: measuring and testing
Dimension
Thickness
C156S064000, C427S008000, C427S009000, C356S625000
Reexamination Certificate
active
07436526
ABSTRACT:
A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.
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Tsai Wen-Li
Tsai Yu-Min
Wu Hsiao-Che
Jianq Chyun IP Office
Lauchman L. G.
ProMOS Technologies Inc.
Underwood Jarreas C
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