Real time polishing process monitoring

Details Real time polishing process monitoring Real time polishing process monitoring

2006-05-30

2006-05-30

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S009000, C451S041000, C451S288000

Reexamination Certificate

active

07052364

ABSTRACT:
A technique for in situ monitoring of polishing processes and other material removal processes employs a quartz crystal nanobalance embedded in a wafer carrier. Material removed from the wafer is deposited upon the surface of the crystal. The resulting frequency shift of the crystal gives an indication of the amount of material removed, allowing determination of an instantaneous removal rate as well as a process endpoint. The deposition on the quartz crystal nanobalance may be controlled by an applied bias. Multiple quartz crystal nanobalances may be used. In a further embodiment of the invention, the quartz crystal nanobalance is used to detect defect-causing events, such as a scratches, during the polishing process.

REFERENCES:
patent: 4197676 (1980-04-01), Sauerland
patent: 4199902 (1980-04-01), Sauerland
patent: 4407094 (1983-10-01), Bennett et al.
patent: 5099614 (1992-03-01), Arai et al.
patent: 5483568 (1996-01-01), Yano et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5643050 (1997-07-01), Chen
patent: 5664990 (1997-09-01), Adams et al.
patent: 5685766 (1997-11-01), Mattingly et al.
patent: 5722875 (1998-03-01), Iwashita et al.
patent: 5836805 (1998-11-01), Obeng
patent: 5865666 (1999-02-01), Nagahara
patent: 5904609 (1999-05-01), Fukuroda et al.
patent: 6007405 (1999-12-01), Mei
patent: 6010538 (2000-01-01), Sun et al.
patent: 6015333 (2000-01-01), Obeng
patent: 6042454 (2000-03-01), Watanabe et al.
patent: 6077147 (2000-06-01), Yang et al.
patent: 6080050 (2000-06-01), Chen et al.
patent: 6293847 (2001-09-01), Easter et al.
patent: 6431953 (2002-08-01), Carter et al.
patent: 6488569 (2002-12-01), Wang et al.
patent: 6520834 (2003-02-01), Marshall
patent: 6558229 (2003-05-01), Kimura et al.
patent: 6561868 (2003-05-01), Edwards et al.
patent: 6634924 (2003-10-01), Koji et al.
patent: 07-040234 (1995-02-01), None

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