Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1995-05-08
1996-03-19
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
1566271, 216 84, 216 86, H01L 2100, B44C 122
Patent
active
055000738
ABSTRACT:
A contactless method and apparatus for real-time in-situ monitoring of a chemical etching process during etching of at least one wafer in a wet chemical etchant bath are disclosed. The method comprises the steps of providing two conductive electrodes in the wet chemical bath, wherein the two electrodes are proximate to but not in contact with a wafer; monitoring an electrical characteristic between the two electrodes as a function of time in the etchant bath of the at least one wafer, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process; and recording a plurality of values of the electrical characteristic as a function of time during etching. From the plurality of recorded values and corresponding times, instantaneous etch rates, average etch rates, and etching end points may be determined. Such a method and the apparatus therefor are particularly useful in a wet chemical etch station.
REFERENCES:
patent: 2933675 (1960-04-01), Hoelzle
patent: 3163568 (1961-02-01), Mieux
patent: 3553052 (1971-01-01), Jubb, Jr.
patent: 3874959 (1975-04-01), Hoekstra
patent: 3959046 (1976-05-01), Bussmann et al.
patent: 3964956 (1976-06-01), Snyder
patent: 4220508 (1980-09-01), Kotani et al.
patent: 4338157 (1982-07-01), Kanda
patent: 4497699 (1985-02-01), de Wit et al.
patent: 4621037 (1986-11-01), Kanda et al.
patent: 4755442 (1988-07-01), Hasebe et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4969973 (1990-11-01), Rinck et al.
patent: 4989157 (1991-01-01), Balisky
patent: 4995939 (1991-02-01), Ferenczi et al.
patent: 5071508 (1991-12-01), Scheithauer
patent: 5081421 (1992-01-01), Miller et al.
patent: 5198072 (1993-03-01), Gabriel et al.
patent: 5338390 (1994-08-01), Bankee
Goubau, W. M., "Capacitive Etch Rate Monitor for Dielectric Etching", IBM Technical Disc. Bulletin vol. 31, No. 1, Jun. 1988, 448-449.
Liu et al., "Resistance/Capacitance Methods for Determining Oxide Etch End Point", IBM Technical Disc. Bulletin vol. 16, No. 8, Jan. 1974, 2706-2707.
Hoekstra, J. P., "Establishing End Point During Delineation Process", IBM Technical Disc. Bulletin vol. 16, No. 6, Nov. 1973, 1717-1720.
Bassous et al., "An In-Situ Etch Rate Monitor Controller", IBM Technical Disc. Bulletin vol. 20, No. 3, Aug. 1977, 1232-1234.
Barbee Steven G.
Heinz Tony F.
Hsiao Yiping
Li Leping
Ratzlaff Eugene H.
Crockatt Dale M.
International Business Machines - Corporation
Powell William
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