Etching a substrate: processes – Nongaseous phase etching of substrate – With measuring – testing – or inspecting
Patent
1994-06-30
1996-12-10
Breneman, R. Bruce
Etching a substrate: processes
Nongaseous phase etching of substrate
With measuring, testing, or inspecting
1566271, H01L 21306
Patent
active
055827462
ABSTRACT:
A contactless method and apparatus for real-time in-situ monitoring of a chemical etching process during etching of at least one wafer in a wet chemical etchant bath are disclosed. The method comprises the steps of providing two conductive electrodes in the wet chemical bath, wherein the two electrodes are proximate to but not in contact with a wafer; monitoring an electrical characteristic between the two electrodes as a function of time in the etchant bath of the at least one wafer, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process; and recording a plurality of values of the electrical characteristic as a function of time during etching. From the plurality of recorded values and corresponding times, instantaneous etch rates, average etch rates, and etching end points may be determined. Such a method and the apparatus therefor are particularly useful in a wet chemical etch station.
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Barbee Steven G.
Heinz Tony F.
Hsiao Yiping
Li Leping
Ratzlaff Eugene H.
Breneman R. Bruce
Crockatt Dale M.
International Business Machines - Corporation
Ronda Mara
Soucar Steven J.
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