Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1995-03-01
1997-08-26
Karlsen, Ernest F.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324752, G01R 3126, G01R 31265
Patent
active
056614080
ABSTRACT:
An apparatus and method for the real-time, in-line testing of semiconductor wafers during the manufacturing process. In one embodiment the apparatus includes a probe assembly within a semiconductor wafer processing line. As each wafer passes adjacent the probe assembly, a source of modulated light, within the probe assembly, having a predetermined wavelength and frequency of modulation, impinges upon the wafer. A sensor in the probe assembly measures the surface photovoltage induced by the modulated light. A computer then uses the induced surface photovoltage to determine various electrical characteristics of the wafer.
REFERENCES:
patent: 4286215 (1981-08-01), Miller
patent: 4333051 (1982-06-01), Goodman
patent: 4433288 (1984-02-01), Moore
patent: 4544887 (1985-10-01), Kamieniecki
patent: 4663526 (1987-05-01), Kamieniecki
patent: 4827212 (1989-05-01), Kamieniecki
patent: 4891584 (1990-01-01), Kamieniecki et al.
patent: 5025145 (1991-06-01), Lagowski
patent: 5087876 (1992-02-01), Reiss et al.
patent: 5091691 (1992-02-01), Kamieniecki et al.
patent: 5177351 (1993-01-01), Lagowski
"Extended Abstracts", Fall Meeting, Oct. 9-14, 1984, vol. 83-2.
"Frequency Dependence of Photo-EMF of Strongly Inverted Ge and Si MIS Structures-II. Experiments", by R.S. Nakhmanson, et al., Solid-State Electronics, 1975, (month unavailable) Vo. 18, pp. 627-634.
"Frequency Dependence of the Photo-EMF of Stronly Inverted Ge and Si MIS Structures-I. Theory" by R.S. Nakhmanson Solid-State Electonics, 1975, (month unavailable) vol. 18, pp. 617-626.
"Ac Surface Photovoltages in Strongly-Inverted Oxidized p-Type Silicon Wafers", by C. Munakata, et al, Japanese Journal of Applied Physics, Nov., 1984, vol. 23, No. 11, pp. 1451-1461.
"Analysis of ac Surface Photovoltages in a Depleted Oxidized p-Type Silicon Wafer", by C. Munakata, et al. Japanese Journal of Applied Physics, Jun., 1986, vol. 25, No. 6, pp. 807-812.
"Non-Destructive Method of Observing Inhomogeneities in p-n Junctions with a Chopped Photon Beam", by C. Munakata, et al., Japanese Journal of Applied Physics, Feb., 1981, vol. 20, No. 2, pp. L137-L140.
"Determination of Surface Charge and Interface Trap Densities in Naturally Oxidized n-Type Si wafers Using ac Surface Photovoltages" by H. Shimizu, et al. Japanese Journal of Applied Physics, Feb. 1987, vol. 26, pp. 226-230.
"Analysis and Control of Electrically Active Contaminants by Surface Charge Analysis" by E. Kamieniecki, et al., Handbook of Semiconductor Wafer Cleaning Technology (date unknown).
"Non-Contact Mapping of Heavy Metal Contamination for Silicon ic Fabrication", by J. Lagowski, et al., Semicond. Sci. Technology, 1992 (month unavailable).
"Determination of Surface Space Charge Capacitance Using a Light Probe", by E. Kamieniecki, J. Vac. Sci. Technology, Mar. 1982.
"A New Method for In-Line, Real-Time Monitoring of Wafer Cleaning Operations", by E. Kamieniecki, et al., Presented during the Symposium on Ultra Cleaning Processing of Silicon Surfaces, Sep. 9-21, 1994.
"Surface Photovoltage Measured Capacitance: Application to Semiconductor/Electrolyte System" by E. Kamieniecki, J. Appl. Phys., Nov. 1983.
AN-1 Application Note--Surface Charge Profiler, "Performance Demonstration", QC Solutions, Inc., Jul. 1994.
AN-2 Application Note--Surface Charge Profiler, "In Wafer Cleaning Monitoring", QC Solutions, Inc., Sep. 1994.
AN-3 Application Note--Surface Charge Profiler, "Monitoring of Wafer Cleansing Using the Surface Charge Profiler on the Back Surfaces of the Wafer", Nov. 1994.
"Surface Charge Profiler" brochure mailed out by QC Solutions, Inc. in Jan. 1995.
"Surface Charge Analysis: A New method to . . . Oxide System", by E. Kamieniecki, Semiconductor Cleaning Technology/ 1989 Electronics and Dielectrics and Insulation Divisions (month unavailable).
Kamieniecki Emil
Ruzyllo Jerzy
Karlsen Ernest F.
QC Solutions, Inc.
LandOfFree
Real-time in-line testing of semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Real-time in-line testing of semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Real-time in-line testing of semiconductor wafers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1990774