Real-time CMOS imager having stacked photodiodes fabricated...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C257S291000, C257S292000, C257SE27133, C257SE27134

Reexamination Certificate

active

11384110

ABSTRACT:
A CMOS active pixel sensor includes a silicon-on-insulator substrate having a silicon substrate with an insulator layer formed thereon and a top silicon layer formed on the insulator layer. A stacked pixel sensor cell includes a bottom photodiode fabricated on the silicon substrate, for sensing light of a longest wavelength; a middle photodiode fabricated on the silicon substrate, for sensing light of a medium wavelength, which is stacked above the bottom photodiode; and a top photodiode fabricated on the top silicon layer, for sensing light of a shorter wavelength, which is stacked above the middle and bottom photodiodes. Pixel transistor sets are fabricated on the top silicon layer and are associated with each pixel sensor cell by electrical connections which extend between each of the photodiodes and respective pixel transistor(s). CMOS control circuitry is fabricated adjacent to an array of active pixel sensor cells and electrically connected thereto.

REFERENCES:
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patent: 5886374 (1999-03-01), Sakamoto et al.
patent: 5965875 (1999-10-01), Merrill
patent: 6727521 (2004-04-01), Merrill
patent: 6930336 (2005-08-01), Merrill
Findlater et al.,A CMOS image sensor with a double junction active pixel, IEEE Trans. Electron Devices, vol. 50, No. 1, pp. 32-42 (2003).

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