Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Warping of semiconductor substrate
Patent
1996-03-19
1998-10-27
Dutton, Brian
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Warping of semiconductor substrate
438 15, H01L 2130, H01L 2146, H01L 2166, G01R 3126
Patent
active
058277714
ABSTRACT:
This invention pertains to a method for processing readout integrated circuits, and to a readout integrated circuit (10) that is processed in accordance with the method. The method includes a first step of providing a plurality of individual readout circuits each having a substrate (12) and at least one layer (14) constructed to have active circuitry that overlies a first surface (12a) of the substrate. Each of the readout integrated circuits has an associated amount of non-flatness or bowing due at least in part to a first force exerted on the substrate by the at least one layer of circuitry. A next step sorts the plurality of readout integrated circuits into a plurality of groups (A, B, C), wherein members of a group have a similar amount of non-flatness. A next step of the method determines, for each group, a thickness of compensating layer (18) and then applies the compensating layer on a second surface (12b) of the substrate so as to exert a second force on the substrate to counteract the first force and to reduce the amount of non-flatness. In a presently preferred embodiment of the invention the step of applying includes a step of sputtering a layer comprised of Si.sub.3 N.sub.4 upon the second surface. The step of sorting includes the steps of operating an interferometer to generate a pattern of fringes for indicating a degree of non-flatness of each of the readout integrated circuits; and counting the fringes and sorting the readout integrated circuits as a function of the number of fringes.
REFERENCES:
patent: 4865245 (1989-09-01), Schulte et al.
patent: 5308980 (1994-05-01), Barton
patent: 5585624 (1996-12-01), Anatourian et al.
Chia Joan K.
Ginn Robert P.
Propst Stephen H.
Dutton Brian
Lenzen, Jr. G. H.
Raytheon Company
Schubert W. C.
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