Read only memory (ROM) having high density memory array with on

Static information storage and retrieval – Interconnection arrangements – Transistors or diodes

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365105, G11C 506, G11C 1706

Patent

active

044197411

ABSTRACT:
The ROM utilizes a diode x-y memory array which can be comprised of a number of suitable materials which form rectifying junctions. The diodes are formed vertically in order to provide a very high density array. On pitch decoder circuitry which is capable of matching the high density of the memory cells in the x-y memory array is also described, as is a unique apparatus for joining adjacent ends of conductive lines which are spaced very close together without increasing their pitch.

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patent: 4124900 (1978-11-01), Smith et al.
patent: 4151020 (1979-04-01), McElroy
patent: 4163242 (1979-06-01), Stein
P. C. Arnett et al., Nonvolatile Diode Cross-Point Memory Array, IBM Tech. Discl. Bul., vol. 17, No. 2, Jul. 1974, p. 365.
H. Kawagoe et al., Minimum Size ROM Structure Compatible with Silicon-Gate E/D MOS LSI, IEEE Journal of Solid-State Circuits, vol. SC-11, No. 3, Jun. 1976, pp. 360-364.
L. Boysel, Memory on a Chip: A Step Toward Large-Scale Integration, Electronics, Feb. 6, 1967, pp. 93-98.
K. Clark, Jr., et al., Electron-Beam Stitching Technique for Use in the Fabrication of Integrated Circuit Devices, IBM Tech. Discl. Bul., vol. 23, No. 7A, Dec. 1980, pp. 2774-2775.
S. --Y. Wu, A Hybrid Mass-Interconnection Method by Electroplating, IEEE Transactions on Electron Devices, vol. ED-25, No. 10, Oct. 1978, pp. 1201-1203.

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