Reactively-bonded thick-film ink

Details Reactively-bonded thick-film ink Reactively-bonded thick-film ink

1974-03-27

1976-06-08

Padgett, Benjamin R.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, H01B 102, H01C 102, H01B 106, H01C 106

Patent

active

039621430

ABSTRACT:
A thick-film ink for forming electrically conductive areas on ceramic substrates comprising an organic vehicle and solids composed of 0.5-8% by weight cupric oxide and 99.5-92% by weight finely divided silver.

REFERENCES:
patent: 2771380 (1956-11-01), Coleman et al.
patent: 3293501 (1966-12-01), Martin
patent: 3843350 (1974-10-01), Larry
patent: 3851228 (1974-11-01), Sheard

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