Reactive thermal transfer medium with encapsulated epoxy

Details Reactive thermal transfer medium with encapsulated epoxy Reactive thermal transfer medium with encapsulated epoxy

1997-09-04

1999-07-06

Hess, Bruce H.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having a component wherein a constituent is liquid...

428195, 428323, 428327, 428412, 428480, B32B 326, B41M 526, B41M 536

Patent

active

059195576

ABSTRACT:
There is provided by the present invention a thermal transfer medium which employs reactive components that crosslink when heated during image transfer to provide images with high scratch and smear resistance. The reactive components comprise an encapsulated liquid epoxy resin and a crosslinker which remain separate while incorporated within a thermal transfer layer until exposed to a thermal print head.

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