Reactive ionized cluster beam deposition method

Details Reactive ionized cluster beam deposition method Reactive ionized cluster beam deposition method

1993-07-28

1995-05-09

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Ion plating or implantation

427250, 427251, 4272552, 4272553, 4272555, 427294, 427296, 427523, 427529, 427566, 427567, 427568, 427576, 427578, 427579, 427585, B05D 306

Patent

active

054138205

ABSTRACT:
A reactive ionized cluster beam deposition method according to this invention is embodied by utilizing two vacuum subregions partitioned by a partition wall formed with an opening. A closed heating crucible and an ionization accelerating unit are disposed in one vacuum subregion partitioned by the partition wall. A substrate is also disposed in the other vacuum subregion, and at the same time a reactive gas is introduced thereinto. Degrees of vacuums in the two vacuum subregions partitioned by the partition wall are equal to or different from each other. Particularly, a gas concentration in the latter vacuum subregion is enhanced. Then, the ionized cluster beams formed in the former vacuum subregion are introduced into the latter vacuum subregion via the opening of the partition wall and react to the reactive gas within the latter vacuum subregion. The ionized cluster beams reacting to the reactive gas impinge on the substrate, thereby forming the deposited film on the substrate surface.

REFERENCES:
Article: Ionized Cluster Beam Deposition & Epitaxy by Toshinori Takagi, Published in Physics of Thin Films, vol. 13, 1987 Copyright By Academic Press, Inc. (No month available).

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