Reactive ion etched assisted gold post process

Details Reactive ion etched assisted gold post process Reactive ion etched assisted gold post process

1995-01-27

1997-11-04

Tsai, Jey

Fishing, trapping, and vermin destroying

437187, 437203, 148DIG106, H01L 21441, H01L 21445

Patent

active

056839367

ABSTRACT:
A process to fabricate a specified height and cross-section of Microwave Monolithic Integrated Circuit gold posts comprising a patterned conductive substrate overlayed by an adhesive layer, a matrix layer, and a photoresist layer. Using photolithographic techniques, gold post locations are defined in the photoresist layer. m Gold post locations and cross-sections are defined in the matrix layer. The adhesive layer at the gold post locations is removed. The gold post locations are plated to form gold posts. The matrix is etched and the adhesive is dissolved.

REFERENCES:
patent: 4401367 (1983-08-01), Grantham et al.
patent: 4782032 (1988-11-01), Geissberger et al.
patent: 4832761 (1989-05-01), Geisberger et al.
patent: 4847212 (1989-07-01), Balzan et al.
patent: 4849376 (1989-07-01), Balzan et al.
patent: 4897361 (1990-01-01), Harriot et al.
patent: 4965218 (1990-10-01), Geissberger et al.
patent: 4988413 (1991-01-01), Chakravorty et al.
patent: 5063655 (1991-11-01), Lamey et al.
patent: 5137597 (1992-08-01), Curry, II et al.
patent: 5162078 (1992-11-01), Bley et al.
patent: 5185292 (1993-02-01), VanVonno et al.
patent: 5270261 (1993-12-01), Bertin et al.

Affiliated with

Also associated with

Rating

Reactive ion etched assisted gold post process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reactive ion etched assisted gold post process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reactive ion etched assisted gold post process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1832750