Reactive hot melt adhesive

Details Reactive hot melt adhesive Reactive hot melt adhesive

2007-11-27

2007-11-27

Seidleck, James J. (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From reactant having at least one -n=c=x group as well as...

C156S331700, C156S306600, C428S423100, C428S425100

Reexamination Certificate

active

10817558

ABSTRACT:
One-component moisture-curing hot melt adhesive compositions based on reaction products from di- or polyisocyanates and polyether-polyols, crystalline or partly crystalline polyester-polyols and low molecular weight polymers from olefinically unsaturated monomers and optionally hydroxylated tackifying resins are suitable for high-strength and ageing-resistant gluing of profiles of plastics to one- or multilayer acrylate films.

REFERENCES:
patent: 4743509 (1988-05-01), Vladimiro
patent: 5021507 (1991-06-01), Stanley et al.
patent: 5827926 (1998-10-01), Shimizu
patent: 5866656 (1999-02-01), Hung et al.
patent: 5869593 (1999-02-01), Helmeke et al.
patent: 5922805 (1999-07-01), Bouttefort et al.
patent: 6218471 (2001-04-01), Chenard et al.
patent: 6221978 (2001-04-01), Li et al.
patent: 6333094 (2001-12-01), Schneider et al.
patent: 6440546 (2002-08-01), Fields et al.
patent: 6465104 (2002-10-01), Krebs et al.
patent: 6482878 (2002-11-01), Chu
patent: 2003/0004263 (2003-01-01), Schmidt, Jr. et al.
patent: 2003/0008970 (2003-01-01), Rumack
patent: 2003/0010442 (2003-01-01), Nowicki et al.
patent: 2003/0010443 (2003-01-01), Rumack
patent: 2003/0022973 (2003-01-01), Hung et al.
patent: 2003/0212235 (2003-11-01), Nowicki et al.
patent: 2003/0213557 (2003-11-01), Nowicki et al.
patent: 2004/0072952 (2004-04-01), Hung et al.
patent: 2004/0072953 (2004-04-01), Hung et al.
patent: 2004/0079482 (2004-04-01), Zhang et al.
patent: 2004/0198899 (2004-10-01), Hung et al.
patent: 2 392 960 (2001-06-01), None
patent: 198 26 329 (1999-12-01), None
patent: 199 63 585 (2001-07-01), None
patent: 41 36 490 (2003-04-01), None
patent: 0 343 491 (1993-06-01), None
patent: WO 99/28363 (1999-06-01), None
patent: WO 99/46358 (1999-09-01), None
patent: WO 01/40342 (2001-06-01), None

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