Re-assembly process for MEMS structures

Details Re-assembly process for MEMS structures Re-assembly process for MEMS structures

2006-03-14

2006-03-14

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S842000, C029S844000, C324S762010, C324S754090, C438S462000, C438S464000

Reexamination Certificate

active

07010854

ABSTRACT:
Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.

REFERENCES:
patent: 5476211 (1995-12-01), Khandros
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6150186 (2000-11-01), Chen et al.
patent: 6255126 (2001-07-01), Mathieu et al.
patent: 6268015 (2001-07-01), Mathieu et al.
patent: 6336269 (2002-01-01), Eldridge et al.
patent: 6441315 (2002-08-01), Eldridge et al.
patent: 6627483 (2003-09-01), Ondricek et al.
patent: 6713374 (2004-03-01), Eldridge et al.
patent: 2001/0001080 (2001-05-01), Eldridge et al.
patent: 2001/0012739 (2001-08-01), Grube et al.
patent: 2002/0019152 (2002-02-01), Eldridge et al.
patent: 2002/0025603 (2002-02-01), Ondricek et al.
patent: 2003/0199179 (2003-10-01), Dozier, II et al.
patent: WO 97/43653 (1997-11-01), None
patent: WO 97/44676 (1997-11-01), None
patent: WO 00/28625 (2000-05-01), None
patent: WO 00/75677 (2000-12-01), None
patent: WO 01/09952 (2001-02-01), None
patent: WO 02/063682 (2002-08-01), None
U.S. Appl. No. 09/710,539, filed Nov. 9, 2000, Eldridge et al.

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