Re-assembly process for MEMS structures

Details Re-assembly process for MEMS structures Re-assembly process for MEMS structures

2011-03-01

2011-03-01

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S050000, C438S051000, C438S052000, C438S053000, C438S106000, C361S720000

Reexamination Certificate

active

07897435

ABSTRACT:
Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.

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