Rate limiting barriers for implantable devices and methods...

Details Rate limiting barriers for implantable devices and methods... Rate limiting barriers for implantable devices and methods...

2007-02-13

2007-02-13

Tarazano, D. Lawrence (Department: 1773)

Coating processes

Medical or dental purpose product; parts; subcombinations;...

Particulate or unit-dosage-article base

C427S002250

Reexamination Certificate

active

10198898

ABSTRACT:
A method of coating an implantable medical device, such as a stent, is disclosed. The method includes applying a formulation on a first polymer layer containing a therapeutic substance to form a second layer. The formulation can contain a highly hydrophobic polymer or a solvent which is a poor solvent for the drug or the polymer of the first layer. The formulation can have a low surface tension value or a high Weber number value.

REFERENCES:
patent: 4931287 (1990-06-01), Bae et al.
patent: 4977901 (1990-12-01), Ofstead
patent: 5112457 (1992-05-01), Marchant
patent: 5328471 (1994-07-01), Slepian
patent: 5455040 (1995-10-01), Marchant
patent: 5464650 (1995-11-01), Berg et al.
patent: 5578073 (1996-11-01), Haimovich et al.
patent: 5605696 (1997-02-01), Eury et al.
patent: 5667767 (1997-09-01), Greff et al.
patent: 5670558 (1997-09-01), Onishi et al.
patent: 5700286 (1997-12-01), Tartaglia et al.
patent: 5716981 (1998-02-01), Hunter et al.
patent: 5824049 (1998-10-01), Ragheb et al.
patent: 5830178 (1998-11-01), Jones et al.
patent: 5837313 (1998-11-01), Ding et al.
patent: 5851508 (1998-12-01), Greff et al.
patent: 5858746 (1999-01-01), Hubbell et al.
patent: 5858990 (1999-01-01), Walsh
patent: 5865814 (1999-02-01), Tuch
patent: 5873904 (1999-02-01), Ragheb et al.
patent: 5971954 (1999-10-01), Conway et al.
patent: 5980928 (1999-11-01), Terry
patent: 5980972 (1999-11-01), Ding
patent: 5997517 (1999-12-01), Whitbourne
patent: 6015541 (2000-01-01), Greff et al.
patent: 6042875 (2000-03-01), Ding et al.
patent: 6051648 (2000-04-01), Rhee et al.
patent: 6056993 (2000-05-01), Leidner et al.
patent: 6060451 (2000-05-01), DiMaio et al.
patent: 6080488 (2000-06-01), Hostettler et al.
patent: 6096070 (2000-08-01), Ragheb et al.
patent: 6099562 (2000-08-01), Ding et al.
patent: 6110188 (2000-08-01), Narciso, Jr.
patent: 6110483 (2000-08-01), Whitbourne et al.
patent: 6113629 (2000-09-01), Ken
patent: 6120536 (2000-09-01), Ding et al.
patent: 6120904 (2000-09-01), Hostettler et al.
patent: 6121027 (2000-09-01), Clapper et al.
patent: 6129761 (2000-10-01), Hubbell
patent: 6153252 (2000-11-01), Hossainy et al.
patent: 6165212 (2000-12-01), Dereume et al.
patent: 6203551 (2001-03-01), Wu
patent: 6214901 (2001-04-01), Chudzik et al.
patent: 6224894 (2001-05-01), Jamiolkowski et al.
patent: 6231590 (2001-05-01), Slaikeu et al.
patent: 6242041 (2001-06-01), Katoot et al.
patent: 6254632 (2001-07-01), Wu et al.
patent: 6258121 (2001-07-01), Yang et al.
patent: 6262034 (2001-07-01), Mathiowitz et al.
patent: 6273913 (2001-08-01), Wright et al.
patent: 6319520 (2001-11-01), Wuthrich et al.
patent: 6344035 (2002-02-01), Chudzik et al.
patent: 2002/0005206 (2002-01-01), Falotico et al.
patent: 2004/0106987 (2004-06-01), Palasis et al.
patent: 2004/0117006 (2004-06-01), Lewis et al.
patent: 0 665 023 (1995-08-01), None
patent: 0 923 953 (1999-06-01), None
patent: 0 970 711 (2000-01-01), None
patent: WO 00/12147 (2000-03-01), None
patent: WO 00/64506 (2000-11-01), None
patent: WO 01/01890 (2001-01-01), None
patent: WO 02/47731 (2002-06-01), None
patent: WO 2004/009145 (2004-01-01), None

Affiliated with

Also associated with

Rating

Rate limiting barriers for implantable devices and methods... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Rate limiting barriers for implantable devices and methods..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Rate limiting barriers for implantable devices and methods... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3886046