Heat exchange – Heating and cooling – Heating and cooling of the same material
Patent
1991-11-06
1993-03-02
Brown, David H.
Heat exchange
Heating and cooling
Heating and cooling of the same material
62 511, 62 521, 118724, 118725, 118728, 165 64, 165 804, 16510433, 165908, 165911, 2504922, F25B 1902, F25B 2900
Patent
active
H00011452
ABSTRACT:
A wafer chuck having a substantially hollow cavity therein utilizes the latent vaporization of a liquid to extract heat from the wafer. An insulated heater provides for heating the wafer to its desired operating point as rapidly as possible in order to bring the wafer to its operating point before plasma etching or deposition occurs.
REFERENCES:
patent: 3109485 (1963-11-01), Fortier
patent: 3414753 (1968-12-01), Hruda
patent: 3501356 (1970-03-01), Chu
patent: 3669812 (1972-06-01), Ensslin
patent: 3724536 (1973-04-01), Baxter
patent: 3843910 (1974-10-01), Ringuet
patent: 3885061 (1975-05-01), Corboy et al.
patent: 4261762 (1981-04-01), King
patent: 4274476 (1981-06-01), Garrett
patent: 4282924 (1981-08-01), Faretra
patent: 4353392 (1982-10-01), Eastman
patent: 4457359 (1984-07-01), Holden
patent: 4496609 (1985-01-01), McNeilly et al.
patent: 4542298 (1985-09-01), Holden
patent: 4549407 (1985-10-01), Gruber
patent: 4603466 (1986-05-01), Morley
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4628991 (1986-12-01), Hsiao et al.
patent: 4635709 (1987-01-01), Attoz
patent: 4671204 (1987-06-01), Ballou
patent: 4680061 (1987-07-01), Lamont
patent: 4705951 (1987-11-01), Layman et al.
patent: 4724621 (1988-02-01), Hobson et al.
patent: 4738748 (1988-04-01), Kisa
patent: 4771730 (1988-09-01), Tezuka
patent: 4810342 (1989-03-01), Inoue
patent: 4838041 (1989-06-01), Bellows et al.
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 4969511 (1990-11-01), Person
Brown David H.
Kidd William W.
Sematech Inc.
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