Rapid rate reactive sputtering of metallic compounds

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204298, C23C 1500

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active

044288123

ABSTRACT:
A method of reactive sputtering of the nitride, oxide or carbide of titanium or similar materials onto a substrate from a target of the pure metal in a chamber utilizing an inert gas, such as argon, wherein the deposition rate of the metallic compound approaches substantially the deposition rate of the pure metal. A reactive gas is introduced into the chamber adjacent to the target at a constant flow and by a rapid pulsing wherein a valve is alternately opened and shut for very short time intervals.

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Aronson, Chen & Class "Preparation of Titanium Nitride by a Pulsed D.C. Magnetron Reactive Deposition Technique Using the Moving Mode of Deposition", 1980, Thin Solid Films, pp. 535-540.

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