Rapid prototyping method for minimizing post processing

Details Rapid prototyping method for minimizing post processing Rapid prototyping method for minimizing post processing

1998-10-26

2000-11-14

Gray, Linda L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156248, 156263, 156267, B32B 3100, B44C 302

Patent

active

061464872

ABSTRACT:
A method for rapid prototyping including generating cutting data including generating a support structure, deriving a silhouette curve, slicing three dimensional data into two dimensional sectional data, generating bridges for every island in the two dimensional sectional data, and generating cutting data and grouping the cutting data into first and second cutting data groups. The method also includes building a part in which an adhesive sheet is used as bond layers which includes cutting the adhesive sheet according to the first cutting data in which a perimeter of excess adhesive sheet region is cut to provide excess adhesive sheet material, peeling of backing paper of the adhesive sheet in which the excess adhesive sheet material is removed with the peeled backing paper, providing and lifting a platform in which the cut adhesive sheet is fed to a previously-built part, bonding in which the fed sheet is bonded to the previously-built part, cutting the bonded adhesive sheet according to the second cutting data in which remaining adhesive sheet edges are cut, lowering the platform, and post processing where the support structure and ridges are removed to form the built part.

REFERENCES:
patent: 5015312 (1991-05-01), Kinzie
patent: 5071503 (1991-12-01), Berman
patent: 5183598 (1993-02-01), Helle et al.
patent: 5514232 (1996-05-01), Burns
patent: 5578155 (1996-11-01), Kawaguchi
patent: 5730817 (1998-03-01), Feygin et al.
patent: 5997681 (1999-12-01), Kinzie

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