Rapid curing, thermally stable adhesive composition comprising e

Details Rapid curing, thermally stable adhesive composition comprising e Rapid curing, thermally stable adhesive composition comprising e

1986-04-14

1987-03-24

Pertilla, Theodore E.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252512, 252513, 523400, 523444, 523458, 523459, 525423, 525426, 525430, H01B 106

Patent

active

046523987

ABSTRACT:
A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) an epoxy resin, (b) a soluble polyimide resin, (c) a reactive solvent; and (d) an alkenylphenol crosslinker which preferably contains polyhydroxy and polyalkenyl substituents. Optionally, the adhesive may also contain a conductive material.

REFERENCES:
patent: 4100140 (1978-07-01), Zahir et al.
patent: 4401777 (1983-08-01), Tsuboi et al.
patent: 4525572 (1985-06-01), Diethelm et al.
patent: 4557860 (1985-12-01), DiSalvo et al.

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