Rapid curing of epoxy resin coating compositions by combination

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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20415911, 427 541, 427 55, 427386, 528 89, B05D 306

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active

042462983

ABSTRACT:
A method for the high speed coating of various substrates utilizes an epoxy composition containing a radiation-sensitive catalyst precursor which will decompose upon exposure to electromagnetic radiation to provide a Lewis acid effective to induce cationic polymerization of the epoxy composition. The formulation does not require any special epoxy monomeric materials or accelerators and is stable until so exposed. Subsequent to applying the formulation to the substrate, the coating is exposed to electromagnetic radiation and a controlled temperature of 50.degree.-90.degree. C. is maintained in the coating for a limited period of time to effect polymerization of the formulation to a tack free surface condition within a period of less than 30 seconds. Maintenance at the elevated temperature following initiation of irradiation may be for a period of as little as 0.5 second.

REFERENCES:
patent: 3709861 (1973-01-01), Anderson
patent: 3711391 (1973-01-01), Feinberg
patent: 3816278 (1974-06-01), Watt
patent: 4069055 (1978-01-01), Crivello

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