Rapid-curing adhesive formulation for semiconductor devices

Compositions – Radioactive compositions – Nuclear reactor fuel

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357 80, 252512, H01L 2314

Patent

active

051501953

ABSTRACT:
A rapid curing adhesive formulation that contains 10-40 wt. % of a cyanate ester vehicle having a cyanate ester, alkylphenol and a metal curing catalyst and 60-90 wt. % of thermally and/or electrically conductive filler. The adhesive formulation has a maximum curing time of 5 minutes, preferably 2 minutes, at 200.degree. C. and is adapted for use in high speed processes for production of bonded semiconductor assemblies.

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D. A. Shimp and W. M. Craig, Jr., entitled New Liquid Dicyanate Monomer for Rapid Impregnation of Reinforcing Fibers, 34th International Sampe Symposium, 1989.
Hi-Tek Polymers, entitled AroCy Cyanate Ester Safety and Handling Bulletin, AroCy Safety and Handling, May 1989.

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