Raised on-chip inductor and method of manufacturing same

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C336S223000, C336S232000, C029S602100, C029S605000

Reexamination Certificate

active

06922127

ABSTRACT:
A raised on-chip planar inductor. An inductor is fabricated on a substrate. The inductor, except for an anchoring extremity, is lifted from the substrate, preferably by application of a magnetic field to a magnetic layer formed on the inductor. The lifting of the inductor deforms a plastic bending region. After the magnetic field is removed, the inductor remains raised with respect to the substrate.

REFERENCES:
patent: 4967156 (1990-10-01), Seitz
patent: 6124650 (2000-09-01), Bishop et al.
patent: 6184755 (2001-02-01), Barber et al.
patent: 6230145 (2001-05-01), Tai et al.
patent: 6362714 (2002-03-01), Rice et al.
patent: 6392524 (2002-05-01), Biegelsen et al.
patent: 6531944 (2003-03-01), Maruyama
patent: 6633219 (2003-10-01), Marbach et al.
Sortor, US2003/0156003A1; Printed Circuit Board Transformer.
Ahn et al., “Micromachined Planar Inductors on Silicon Wafters for MEMS Applications”, IEEE Transactions on Industrial Electronics, vol. 45, No. 6, Dec. 1998.
Ashby et al., “High Q inductors for wireless applications in a complementary silicon biopolar process”, IEEE J. Solid-State Circuits, vol. 31, No. 1, pp. 4-9, 1996.
Burghartz et al., “Microwave Inductors and Capacitors in Standard Multilevel Interconnect Silicon Technology”, IEEE Transactions on Microwave Theory and Techniques, vol. 44, No. 1, Jan. 1996.
Burghartz et al., “RF Design Aspects of Spiral Inductors on Silicon”, IEEE J. Solid-State Circuits, vol. 33, No. 12, pp. 2028-2033, 1998.
Comtois et al., “Applications for surface micromachined polysilicon thermal actuators and arrays”, Proc. IEEE Solid-State Sensors & Actuators Workshop, pp. 174-177, 1996.
Daneman et al, “Linear microvibromotor for positioning optical components”, IEEE J. Microelectromechanic. Syst., vol. 5, No. 3, pp. 159-165, 1996.
Fan et al., “Self-assembled microactuated XYZ stages for optical scanning and alignment”, Proc. Int. Conf. Solid-State Sensors and Actuators, vol. 1, pp. 319-322, 1997.
Green et al., “Demonstration of Three-Dimensional Microstructure Self-Assembly”, IEEE J. Microelectromechanic. Syst., vol. 4, No. 4, pp. 170-176, 1995.
Harsh et al., “Solder self-assembly for three-dimensional microelectromechanical systems”, Sensors & Actuators A, vol. 77, pp. 237-244, 1999.
Hoffman et al., “3D structures with piezoresistive sensor in standard CMOS”, Proc. IEEE Workshop on Microelectromechanical Systems, pp. 288-293, 1995.
Judy et al., “Magnetic microactuation of Polysilicon Flexure Structures”, IEEE J. Microelectromechc. Syst., vol. 4, No. 4, pp. 162-169, 1995.
Liu et al., “Out-of-Plane Permalloy magnetic actuators for delta-wing control”, Proc. IEEE Microelectromechanical Systems Workshop, pp. 7-12, 1995.
Liu et al., “Surface micromachined magnetic actuators” Proc. IEEE Workshop on Electromechanical Systems, pp. 57-62, 1994.
O'Sullivan et al., “Integrated, variable-reluctance magnet minimotor”, IBM Journal of Research and Development, Electrochemical Microfabrication, vol. 42, No. 5, 1998.
Ozgur et al., “High Q Backside Micromachined CMOS Inductors”, IEEE International Symposium on Circuits and Systems, p. 577-580, 1999.
Pister et al., “Microfabricated hinges”, Sensors and Actuators A, vol. 33, No. 3, pp. 249-256, 1992.
Reid et al., “Automated Assembly of flip-up micromirrors”, Proc. 1997 Int. Conf. Solid-State Sensors and Actuators, vol. 1, pp. 292-298, 1997.
Ribas et al., “Micromachined Planar Spiral Inductor in Standard GaAs HEMT MMIC Technology”, IEEE Electron Device Letters, vol. 19, No. 8, Aug. 1998.
Syms, “Equilibrium of hinged and hingeless structures rotated using surface tension forces”, IEEE J. Microelectromechanic. Syst., vol. 4, No. 4, pp. 177-184, 195.
Syms, “Surface tension powered self-assembly of 3-D micro-optomechanical structures”, IEEE J. Microelectromechanic. Syst., vol. 8, No. 4, pp. 448-455, 1999.
Wu, “Micromachining for optical and optoelectronics systems”, Proc. IEEE, vol. 85, No. 11, pp. 1833-1856, 1997.
Yi et al., Magnetic Actuation of Hinged Microstructures, IEEE J. Microelectromechanic. Syst., vol. 8, No. 1, pp. 10-17, 1999.
Yoon et al., “High-Performance Three-Dimensional On-Chip Inductors Fabricated by Novel Micromachining Technology for RF MMIC”, IEEE MTT-S Digest, p. 1523-1526, 1999.
Zou et al., “Plastic Deformation Magnetic Assembly (PDMA) of 3D Microstructures: Technology Development & Application”, Micro Actuator, Sensor and System Research Group, Microelectronics Laboratory, pp. 1-27.
Zou et al., “Plastic Deformation Magnetic Assembly (PDMA) of Out-of-Plane Structures: Technology & Application”.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Raised on-chip inductor and method of manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Raised on-chip inductor and method of manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Raised on-chip inductor and method of manufacturing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3414386

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.