Raised fuse structure for laser repair

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257209, 438132, 438601, H01L 2900

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active

059106786

ABSTRACT:
A novel raised polycide fusible link structure is described. This structure enables a highly reliable laser-cutting process to be used in which the fuse can be easily and totally severed over a wide range of laser energy levels. The primary feature of the structure is that the fusible link is located on a pedestal that raises it above the surface of the main body of the integrated circuit, thereby providing a measure of thermal isolation for the fuse when it is irradiated by the laser. An efficient process for manufacturing the structure is also described.

REFERENCES:
patent: 4536949 (1985-08-01), Takayama et al.
patent: 5025300 (1991-06-01), Billig et al.
patent: 5241212 (1993-08-01), Motonami et al.
patent: 5652459 (1997-07-01), Chen
patent: 5747868 (1998-05-01), Reddy et al.

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