Raised feature/gold dot pressure interconnections of rigid-flex

Details Raised feature/gold dot pressure interconnections of rigid-flex Raised feature/gold dot pressure interconnections of rigid-flex

1993-01-14

1994-03-22

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439493, H01R 2366, H01R 2368

Patent

active

052958388

ABSTRACT:
A multi-layer rigid-flex circuit (20) is formed of a number of flexible layers (62-70) on a rigid substrate (100) with individuals ones of the layers having laterally projecting arms (32,38) that define flexible circuit connections to individual ones of a number of ceramic circuit boards (10,12,14,16). The laterally projecting flexible arms (32,34,36,38) are each formed with gold dot or projecting feature pressure contacts (40a-40g) which are pressed against mating sets of circuit board contact pads (40a-40g) by a clamping bar (120) that is bolted to the rigid circuit board. Thus the interconnections between the rigid-flex circuit and the circuit boards are effectively built into the rigid-flex circuit, requiring only a clamp to complete the connection.

REFERENCES:
patent: 4125310 (1978-11-01), Reardon, II et al.
patent: 4453795 (1984-06-01), Moulin
patent: 4489999 (1984-12-01), Miniet
patent: 4711548 (1987-12-01), Arakawa et al.
patent: 4871315 (1989-10-01), Noschese
patent: 5095628 (1992-03-01), McKenney et al.
patent: 5197184 (1993-03-01), Crumly et al.
patent: 5207887 (1993-05-01), Crumly et al.

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