Rail bonded multi-chip leadframe, method and package

Details Rail bonded multi-chip leadframe, method and package Rail bonded multi-chip leadframe, method and package

1986-08-22

1988-04-26

Macon, Robert S.

Electricity: electrical systems and devices

Miscellaneous

361415, 174 52PE, 174 52FP, H05K 502

Patent

active

047408685

ABSTRACT:
A leadframe including a plurality of rails connected directly to input leads and output leads. A plurality of chips can be mounted directly to the plurality of rails forming a rail bonded multi-chip device. Wire bonding can occur directly from the chips to the plurality of rails which function as a heat sink. The resultant multi-chip device is simple, inexpensive, and easy to manufacture.

REFERENCES:
patent: 3898535 (1975-08-01), Ebbert
patent: 3978375 (1976-08-01), Fukui et al.
patent: 4264917 (1981-04-01), Ugon
patent: 4331831 (1982-05-01), Ingram et al.
patent: 4337499 (1982-06-01), Cronin et al.
patent: 4542260 (1985-09-01), Pearce

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