Radiofrequency wave treatment of a material using a selected seq

Electric heating – Metal heating – Of cylinders

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

219 1055A, 219 1055F, 219 1055B, H05B 674

Patent

active

050085069

ABSTRACT:
A radiofrequency wave apparatus including an applicator (112, 120) which provides multiple, sequenced processing modes for use in a method for heating a material is described. The modes in the applicator are selected to suit each stage of the processing of a material (B). The apparatus can include multiple circuits (11, 12 and 13) which couple the radiofrequency waves to the applicator using probes (111a, 121a and 122a) in the method. The result is the optimum processing of the material.

REFERENCES:
patent: 2790054 (1957-04-01), Haagensen
patent: 3364331 (1968-01-01), Johnson
patent: 3699899 (1972-10-01), Schiffmann et al.
patent: 3851131 (1974-11-01), Johnston et al.
patent: 4196332 (1980-04-01), MacKay et al.
patent: 4314128 (1982-02-01), Chitre
patent: 4507588 (1985-03-01), Asmussen et al.
patent: 4585688 (1986-04-01), Asmussen et al.
patent: 4714812 (1987-12-01), Haagensen et al.
patent: 4777336 (1988-10-01), Asmussen
J. Asmussen and J. Root, Appl. Phys. Letters 44, 396 (1984).
J. Root and J. Asmussen, Rev. of Sci. Instrum. 56, 1511 (1985).
M. Dahimene and J. Asmussen, J. Vac. Sci. Technol. B4, 126 (1986).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radiofrequency wave treatment of a material using a selected seq does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiofrequency wave treatment of a material using a selected seq, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiofrequency wave treatment of a material using a selected seq will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-422775

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.