Radio frequency-transmissive compositions, methods of forming ra

Details Radio frequency-transmissive compositions, methods of forming ra Radio frequency-transmissive compositions, methods of forming ra

1997-08-14

2000-09-05

Dawson, Robert

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525107, 525123, 525222, 525165, 525105, 525106, C08F 800

Patent

active

061144479

ABSTRACT:
Radio frequency-transmissive compositions having reduced dissipation factors, microelectronic devices, and in particular, wireless radio frequency communication devices which utilize such compositions, and methods of forming the same are described. In one implementation, a liquid resin is provided and a solid organic polymer filler material is provided within the resin to impart a degree of radio frequency transmissivity which is greater than that of the resin alone, i.e. the composition has a reduced dissipation factor. An exemplary resin comprises epoxy and an exemplary filler material is a polytetrafluoroethylene powder. In another implementation, such composition is formed or applied over a substrate which includes an antenna formed thereon and cured to provide a solid coating. The substrate can also have integrated circuitry and a battery mounted thereon to provide a wireless communication device. In such a case, the composition can be formed over and cured atop the integrated circuitry and the battery.

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patent: 5019604 (1991-05-01), Lemole
patent: 5621412 (1997-04-01), Sharpe et al.
patent: 5649296 (1997-07-01), MacLellan et al.

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