Radio frequency semiconductor device and method of...

Semiconductor device manufacturing: process – Making passive device

Reexamination Certificate

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Reexamination Certificate

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07037800

ABSTRACT:
The present invention discloses a high frequency device including a first wafer providing an inductor having via contact plugs passing through the first wafer and a second wafer bonded to the first wafer, wherein the second wafer provides logic devices and inductor connection lines on an upper side thereof.

REFERENCES:
patent: 6744114 (2004-06-01), Dentry et al.

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