Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2006-05-02
2006-05-02
Owens, Douglas W (Department: 2811)
Semiconductor device manufacturing: process
Making passive device
Reexamination Certificate
active
07037800
ABSTRACT:
The present invention discloses a high frequency device including a first wafer providing an inductor having via contact plugs passing through the first wafer and a second wafer bonded to the first wafer, wherein the second wafer provides logic devices and inductor connection lines on an upper side thereof.
REFERENCES:
patent: 6744114 (2004-06-01), Dentry et al.
Hynix / Semiconductor Inc.
Mayer Brown Rowe & Maw LLP
Owens Douglas W
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