Radio-frequency module for communication

Details Radio-frequency module for communication Radio-frequency module for communication

2005-07-25

2008-10-14

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S764000, C361S782000

Reexamination Certificate

active

07436679

ABSTRACT:
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

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Office Action dated Oct. 23, 2007, issued in corresponding Japanese Patent Application No. 2005-066027.
Japanese Office Action dated Oct. 23, 2007, issued in corresponding Japanese Patent Application No. 2005-066027.
Japanese Office Action dated May 7, 2008, Application No. 2005-066027.

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