Radio frequency module assembly

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

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Details

C174S535000, C361S752000

Reexamination Certificate

active

07868258

ABSTRACT:
A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.

REFERENCES:
patent: 4661888 (1987-04-01), Jewell et al.
patent: 4980516 (1990-12-01), Nakagawa
patent: 7170002 (2007-01-01), Thompson
patent: 2005/0272399 (2005-12-01), Murata
patent: 2005-317847 (2005-11-01), None
patent: 1989-0001852 (1989-03-01), None
patent: 1999-008538 (1999-03-01), None
patent: 10-2004-0044038 (2004-05-01), None

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