Radio frequency module and method for fabricating the radio freq

Details Radio frequency module and method for fabricating the radio freq Radio frequency module and method for fabricating the radio freq

1997-06-11

2000-08-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361728, 361736, 361746, 361760, 361762, 361767, 361783, 361807, 257676, 257684, 257690, 257698, 257704, 257787, 257773, 257774, 174 524, 174 521, H05K 702

Patent

active

060976128

ABSTRACT:
The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a semiconductor device. The semiconductor device is thermally and electrically coupled to the second metal film, and a thickness of the second metal film is larger than that of the first metal film.

REFERENCES:
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5243320 (1993-09-01), Clouser et al.
patent: 5500555 (1996-03-01), Ley
patent: 5541450 (1996-07-01), Jones et al.
patent: 5569955 (1996-10-01), Chillara et al.
patent: 5599747 (1997-02-01), Bhatt et al.

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