Radio frequency module and method for fabricating the radio freq

Metal working – Method of mechanical manufacture – Electrical device making

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29830, 29852, A05K 330

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06158116&

ABSTRACT:
The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a semiconductor device. The semiconductor device is thermally and electrically coupled to the second metal film, and a thickness of the second metal film is larger than that of the first metal film.

REFERENCES:
patent: 3872583 (1975-03-01), Beall et al.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4881116 (1989-11-01), Hidada et al.
patent: 5206986 (1993-05-01), Arai et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5243320 (1993-09-01), Clouser et al.
patent: 5500555 (1996-03-01), Ley
patent: 5541450 (1996-07-01), Jones et al.
patent: 5569955 (1996-10-01), Chillara et al.
patent: 5599747 (1997-02-01), Bhatt et al.
patent: 5622588 (1997-04-01), Weber
Office Action Dated Jan. 7, 1999 related to Japanese Patent Application No. 9-153934 (Including English Translation).
European Search Report dated Mar. 8, 1999 related to European Patent Application No. 97109577.3.

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