Radio frequency module

Details Radio frequency module Radio frequency module

2005-04-12

2005-04-12

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S252000, C361S719000

Reexamination Certificate

active

06879488

ABSTRACT:
In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

REFERENCES:
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patent: 6205028 (2001-03-01), Matsumura
patent: 6633005 (2003-10-01), Ichitsubo et al.
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patent: 7-147349 (1995-06-01), None
patent: 9-8584 (1997-01-01), None
patent: 9-27570 (1997-01-01), None
patent: 11-266546 (1999-09-01), None

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