Radio-frequency hybrid switch module

Details Radio-frequency hybrid switch module Radio-frequency hybrid switch module

2002-09-10

2004-07-06

Summons, Barbara (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S193000, C333S101000

Reexamination Certificate

active

06759925

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a radio-frequency hybrid switch module for use in mobile communications equipment including a mobile phone.
BACKGROUND ART
FIG. 1
is a circuit block diagram of an antenna duplexer used in a GSM/DCS dual-band mobile phone conforming to European standards for mobile communications based on a Time Division Multiple Access system. The antenna duplexer includes antenna terminal
1
, GSM-band transmitting (GSM-TX) terminal
2
, GSM-band receiving (GSM-RX) terminal
3
, DCS-band transmitting (DCS-TX) terminal
4
, DCS-band receiving (DCS-RX) terminal
5
, diplexer
6
for separating and combining frequency components in GSM and DCS bands, switches
7
,
8
for switching between transmission and reception, low pass filters (LPFs)
9
,
11
for removing unwanted harmonic signals, and surface acoustic wave (SAW) filters
10
,
12
for allowing a band of received frequencies to pass.
FIG. 10
shows a structure of a conventional antenna duplexer. This antenna duplexer includes ceramic multi-layer substrate
18
, alumina package
19
, SAW device chip
20
, bonding wire
21
, lid
22
of alumina package
19
, diodes
23
functioning as switching devices, chip devices
24
, pad
25
formed on the alumina package for wire bonding, and metal cap
26
. Ceramic multi-layer substrate
18
includes a LPF and a diplexer formed therein.
In the duplexer described above, SAW chip
20
is put in alumina package
19
and mounted over ceramic multi-layer substrate
18
. Alumina package
19
, for being sealed hermetically with lid
22
, needs to has a wall thickness
19
a
ranging from about 0.5 mm to 1.0 mm, Thus hardly having a reduced size.
DISCLOSURE OF THE INVENTION
A small radio-frequency (RF) hybrid switch module is provided for switching between transmit-signals and receive-signals in plural frequency bands.
This module includes: a laminated body having a dielectric layer; a diplexer; a switching circuit; a low pass filter (LPF); a conductive pattern on the dielectric layer for forming at least one of the diplexer, the switching circuit and the LPF; a surface acoustic wave (SAW) filter mounted on the laminated body; a cover on the SAW filter for forming a cavity which allows surface acoustic wave vibration and hermetically sealing the cavity, and a semiconductor switching device mounted on the laminated body for forming a part of the switching circuit.


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International Search Report corresponding to application No. PCT/JP01/08792 dated Jan. 15, 2002, Along with English translation.

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