Radio frequency filter feedthrough structure for multilayer circ

Wave transmission lines and networks – Coupling networks – Frequency domain filters utilizing only lumped parameters

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333184, 333185, 361414, H03H 700

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050399659

ABSTRACT:
A multilayer circuit board (200) providing a feedthrough filter having metallized via (234) having input and output ports (232, 226) which are coupled to metallized areas (206, 214). Each of the metallized areas (206, 214) being opposed by ground planes (202, 210, and 218) which are separated from the metallized areas (206, 214) by dielectric layers (204, 208, 212, and 216) forming a reactive coupling between the metallized areas (206, 214) and the ground planes (202, 210, and 218). The multilayer circuit board as employed in the present invention, may be advantageously utilized in a variety of applications where multilayer circuit boards require attenuation of unwanted RF signals.

REFERENCES:
patent: 3538464 (1970-11-01), Walsh
patent: 4144509 (1979-03-01), Boutros
patent: 4614925 (1986-09-01), Kane
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 4868980 (1989-09-01), Miller, Jr.
patent: 4945323 (1990-07-01), Gerstenberg et al.
patent: 4945399 (1990-07-01), Brown et al.
patent: 4950185 (1990-08-01), Boutros
patent: 4954877 (1990-09-01), Nakanishi et al.

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