Radio frequency circuit module on multi-layer substrate

Details Radio frequency circuit module on multi-layer substrate Radio frequency circuit module on multi-layer substrate

2005-01-11

2005-01-11

Jones, Stephen E. (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S033000

Reexamination Certificate

active

06842093

ABSTRACT:
An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

REFERENCES:
patent: 3201722 (1965-08-01), May et al.
patent: 3617877 (1971-11-01), Hobson
patent: 3686594 (1972-08-01), Hoppis et al.
patent: 3784933 (1974-01-01), Scherer et al.
patent: 4326180 (1982-04-01), Ferri
patent: 4768004 (1988-08-01), Wilson
patent: 4867704 (1989-09-01), Standke
patent: 4930215 (1990-06-01), Roche et al.
patent: 4995815 (1991-02-01), Buchanan et al.
patent: 5404117 (1995-04-01), Walz
patent: 5469130 (1995-11-01), Okada et al.
patent: 5532659 (1996-07-01), Dodart
patent: 5613859 (1997-03-01), Bellantoni et al.
patent: 5923234 (1999-07-01), Holzman et al.
patent: 6285273 (2001-09-01), Morikawa
patent: 2 551 269 (1985-03-01), None
patent: 60-182801 (1985-09-01), None
patent: 02-234501 (1990-09-01), None
patent: 05-235613 (1993-09-01), None
patent: 06-112707 (1994-04-01), None
patent: 06-350312 (1994-12-01), None
patent: 10-145114 (1998-05-01), None
patent: 11-308018 (1999-11-01), None

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