Radiator shaping device

Metal founding – Means to shape metallic material – Including means to assemble mold parts

Reexamination Certificate

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Details

C164S333000, C164S334000

Reexamination Certificate

active

06257314

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a radiator shaping device which serves in manufacturing a radiator with a high heat conductivity, thus the radiator may be used to effectively and rapidly cool electronic elements with high heat generation.
BACKGROUND OF THE INVENTION
The radiator
1
of a conventional electronic elements is illustrated in
FIG. 1
, the structure thereof is formed by aluminum material By aluminum extrusion or press molding, a lower plate
10
and a plurality of spaced fins
11
stand upright at the lower plate so that by the increment of area and the slots
12
between the fins
11
, a heat dissipating function is achieved. However, in the radiator
1
made by aluminum extrusion or press molding, the widths of the fins
11
are limited and thus can not be reduced to a desired size. Namely, the fins
11
shaped from a lower plate
10
with the same area are finite. Therefore. under the confinement of the same area and height, the total area of heat dissipation can not be increased greatly.
Therefore, a radiator with the same area and height but having a large heat dissipating area has been developed. As shown in
FIG. 2
, the radiator
2
has a U shaped lower plate
20
. A folded radiating piece formed by folding single thin aluminum piece is fixed in the U shape space. By the character that the width of the piece is very thin, more fins
210
and slots
211
are formed on the same area and height. However, this aluminum folded radiating piece
21
is adhered to the aluminum lower plate
20
by glue (such as head conductive glue) having a bad heat conductivity. Because of the isolation of the glue the heat transformation between the folded radiating piece
21
and the lower plate
20
is poor. Therefore, heat efficiency can not be attained to desired effect. Besides, since the glue is applied between the folded radiating piece
21
and the lower plate
20
and has a physical property different from aluminum. Thus, for a long period of heat expansion and cool contraction, the glue will deteriorate in quality and the adhesion becomes poor so that the contact between the folded radiating piece
21
and the lower plate
20
is worse and thus heat transformation is not preferred. This is necessary to be improved.
SUMMARY OF THE INVENTION
Accordingly, the primary object of the present invention is to provide a radiator shaping device comprising a lower mold, an upper mold and two movable molds. The aluminum folded radiating piece is formed integrally with an aluminum lower plate, thus the radiator may effectively use the folded radiating piece with a large radiating area and a preferred heat radiating effect. Moreover, the folded radiating piece and the lower plate are made of the same material, thus heat is transferred directly and rapidly. Moreover, the structure is more steady. Therefore, the complete heat dissipation effect is improved effectively.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing.


REFERENCES:
patent: 5533257 (1996-07-01), Romero et al.
patent: 5562146 (1996-10-01), Harmon et al.

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