Radiator heater solder pouring process

Details Radiator heater solder pouring process Radiator heater solder pouring process

1985-01-28

1986-08-12

Godici, Nicholas P.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228183, 228187, 228200, 228226, 228257, 228 9, 228 37, 228 47, 291573R, 291573C, B23K 3102, B21D 5302, B23P 1526

Patent

active

046051546

ABSTRACT:
This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T.sub.1. Infrared heat heats the header to a temperature T.sub.2 which is less than T.sub.1 but above a lower temperature T.sub.3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T.sub.2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.

REFERENCES:
patent: 454618 (1891-06-01), Gaiger
patent: 2313315 (1943-03-01), Blair
patent: 2417662 (1947-03-01), Rosales
patent: 2489888 (1949-11-01), Huber
patent: 4157155 (1979-06-01), Smith

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