Radiation type BGA package and production method therefor

Details Radiation type BGA package and production method therefor Radiation type BGA package and production method therefor

2005-03-01

2005-03-01

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S726000, C257S727000

Reexamination Certificate

active

06861747

ABSTRACT:
(1) A thermal enhanced type of BGA package, in which a metal heat sink is joined to one side of a plastic circuit board which has a cutout space in the central portion, comprised of a clamping member joining the plastic circuit board and the heat sink. A caulking member, a rivet, a screw, an eyelet, or a tubular rivet could be used as the clamping member. It is preferable that a dam member is definitely attached by the clamping member.(2) Another thermal enhanced type of BGA package, in which a circuit pattern is provided in the plastic circuit board and the heat sink and/or the dam member are electrically connected to a part of the circuit pattern through the clamping member. It is preferable to use the clamping member coated by solder.

REFERENCES:
patent: 0 554 893 (1993-08-01), None
patent: 1-125590 (1989-08-01), None
patent: 5-243429 (1993-09-01), None
patent: 5-343588 (1993-12-01), None
patent: 8-293569 (1996-11-01), None
patent: 11-150219 (1999-06-01), None
patent: 11-163230 (1999-06-01), None
patent: 11-340389 (1999-12-01), None
patent: 2001-035975 (2001-02-01), None

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