Radiation shielding of three dimensional multi-chip modules

Details Radiation shielding of three dimensional multi-chip modules Radiation shielding of three dimensional multi-chip modules

1997-01-24

1999-03-09

Kincaid, Kristine

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 522, 174 524, 361816, 257713, 257699, 257659, H05K 900

Patent

active

058804030

ABSTRACT:
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

REFERENCES:
patent: 4089575 (1978-05-01), Grabbe
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4967315 (1990-10-01), Schelhorn
patent: 5239126 (1993-08-01), Oshiba
patent: 5250845 (1993-10-01), Runyan
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 5635754 (1997-06-01), Strobel et al.

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