Radiation shielding of integrated circuits and multi-chip...

Details Radiation shielding of integrated circuits and multi-chip... Radiation shielding of integrated circuits and multi-chip...

2006-12-12

2006-12-12

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

C257SE21499, C257SE23114, C257SE23115

Reexamination Certificate

active

07148084

ABSTRACT:
A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.

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