Radiation shielding for integrated circuit devices using reconst

Details Radiation shielding for integrated circuit devices using reconst Radiation shielding for integrated circuit devices using reconst

1993-12-09

1995-04-11

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257660, 257790, 257921, H01L 2328

Patent

active

054061172

ABSTRACT:
A pre-molded plastic package has encapsulation material removed so that an upper cavity is formed above the die and its associated wirebonds and a lower cavity is formed below the die attach pad and lead frame. Advantageously, the encapsulating material is removed without damaging the die, its associated wirebonds or the lead frame. An upper shield is then mounted on the top side over the still encapsulated die and wirebonds. Encapsulating material, such as epoxy, is then placed about the upper shield and cured. A lower shield is then mounted on the bottom side the die attach pad and lead frame. Encapsulating material is also placed over the lower shield and cured. Advantageously, the invention provides a process alternative whereby the shields can be installed at a very low per unit cost and in only minutes per unit without the need for custom tooling.

REFERENCES:
patent: 4661837 (1987-04-01), Sono
patent: 4839716 (1989-06-01), Butt
patent: 4953002 (1990-08-01), Nelson et al.
patent: 5138430 (1992-08-01), Gow et al.
patent: 5149662 (1992-09-01), Eichelberger
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5294826 (1994-03-01), Marcantonio et al.
Charles A. Harper, "Electronic Packaging and Interconnection Handbook", 1991, pp. 6.41-6.49., McGraw-Hill.
Caroline Kovac et al., "Plastic Package Fabrication", 1989, vol. 1, pp. 470-480., ASM International.

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