Radiation shielded semiconductor package

Details Radiation shielded semiconductor package Radiation shielded semiconductor package

2006-10-03

2006-10-03

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C174S050510, C257S659000

Reexamination Certificate

active

07115812

ABSTRACT:
A radiation shielded semiconductor package for use in any variety of industries and applications is disclosed. In one embodiment, a radiation shielded semiconductor package comprises a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, and one or more non-shielding coupling flanges coupled to the shielding flange. The base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, and at least one semiconductor device is positioned within the device cavity. A radiation shielding lid is coupled to the coupling flange and hermetically seals the semiconductor device within the device cavity. The shielding lid comprises shielding lid body and a non-shielding lid flange coupled to the lid body and is configured to couple to the coupling flange.

REFERENCES:
patent: 4888449 (1989-12-01), Crane et al.
patent: 5317107 (1994-05-01), Osorio
patent: 5825042 (1998-10-01), Strobel et al.
patent: 6262362 (2001-07-01), Czjakowski et al.
patent: 6452263 (2002-09-01), Benedetto

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