Electrical transmission or interconnection systems – Anti-induction or coupling to other systems – Magnetic or electrostatic field control
Patent
1985-01-31
1986-07-22
Shoop, Jr., William M.
Electrical transmission or interconnection systems
Anti-induction or coupling to other systems
Magnetic or electrostatic field control
361424, 361393, 361394, H04B 328, H05K 900
Patent
active
046021647
ABSTRACT:
A methodology for packaging and grounding electronic devices including distributive data processing systems wherein a Main Processing Unit (MPU) and power supply are packaged within a common housing. The MPU and other electrical components are placed on a common support card or substrate. The substrate is provided with plugs for mating with the power supply and I/O connectors for mating with devices which may be remotely attached thereto. Each connector is fitted with a shielded receptacle that coacts with the common housing to provide EMC shielding for the MPU and other electrical components. The packaging is such that an untrained person may replace the card without compromising the integrity of the EMC shield.
REFERENCES:
patent: 3691432 (1972-09-01), Edfors et al.
patent: 3963975 (1976-06-01), Gauper, Jr. et al.
patent: 4342002 (1982-07-01), Gabr
patent: 4399487 (1983-08-01), Neumann
patent: 4527285 (1985-07-01), Kekas et al.
Gore, III Albert N.
Lynch Robert C.
McAdams Ronald P.
Shekita Gregory A.
Cockburn Joscelyn G.
Hoyte Alfred
International Business Machines Corp.
Shoop Jr. William M.
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