Radiation-sensitive resin composition, forming process for...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Screen other than for cathode-ray tube

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S191000, C430S192000, C430S193000, C430S326000

Reexamination Certificate

active

06984476

ABSTRACT:
The invention provides a radiation-sensitive resin composition, by which a patterned insulation film whose water repellency varies is easily formed with high precision, a process for forming a patterned insulation film using this composition, a display element and an flat-panel disply device using the composition, and a process for producing the flat-panel disply device.The resin composition comprises (A) an alkali-soluble copolymer, (B) a 1,2-quinonediazide compound and (C) a water-repellent siloxane resin in particular proportions. In the production process of the patterned insulation film, patterning exposure and development are conducted on a coating formed of the resin composition. The display element and flat-panel disply device are equipped with an interlayer insulation film formed by the resin composition. The production process of the flat-panel disply device comprises an interlayer insulation film-forming step including a treatment of patterning exposure exposing conductor layer-forming regions in an exposure that only surface layer portions are cured in one part thereof, and the whole in the thickness-wise direction thereof is cured in the other parts, and a conductor layer-forming step of forming conductor layers on the surface of the interlayer insulation film with a liquid material.

REFERENCES:
patent: 5362597 (1994-11-01), Sano et al.
patent: 6797450 (2004-09-01), Suzuki et al.
patent: 2002/0136979 (2002-09-01), Miyake et al.
patent: 2003/0134222 (2003-07-01), Lee et al.
patent: 2004/0101780 (2004-05-01), Maemoto
patent: 2004/0248030 (2004-12-01), Kim et al.
patent: 2000-223270 (2000-08-01), None
patent: WO 99/10862 (1999-03-01), None
patent: WO 99/48339 (1999-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Radiation-sensitive resin composition, forming process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Radiation-sensitive resin composition, forming process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation-sensitive resin composition, forming process for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3581333

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.