Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1993-02-16
1998-05-19
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430192, 430193, 430326, G03F 7023
Patent
active
057534063
ABSTRACT:
A radiation-sensitive resin composition comprising an alkali-soluble novolak resin and a 1,2-quinonediazide compound, wherein the alakli-soluble novolak resin comprises a mixture of:
95-50 parts by weight of Resin A having a standard polystyrene-reduced resin selected from the group consisting of a resin obtained by polycondensation of m-cresol and at least one phenol represented by the structural formula (I) or (I'): ##STR1## wherein m is 2 or 3, with at least one aldehyde and a resin obtained by polycondensation of m-cresol, p-cresol and at least one phenol represented by the above structural formula (I) or (I') with at least one aldehyde! and
5-50 parts by weight of Resin B having a standard polystyrene-reduced by polycondensation of at least one phenol represented by the structural formula (II): ##STR2## wherein n is 0, 1, 2 or 3, with at least one aldehyde!. In the resin composition, the mixture of Resin A and Resin B may further contain Resin C which is an ester of Resin B with a 1,2-quinonediazidesulfonic acid.
REFERENCES:
patent: 4477553 (1984-10-01), Yamamoto et al.
patent: 4797346 (1989-01-01), Yamamoto et al.
patent: 4971887 (1990-11-01), Schmitt et al.
patent: 4988601 (1991-01-01), Ushirogouchi et al.
patent: 5019479 (1991-05-01), Oka et al.
patent: 5087548 (1992-02-01), Hosaka et al.
U.S. application No. 08/008,661, filed Jan. 25, 1993.
U.S. application No. 08/018,221, filed Feb. 16, 1993.
Miura Takao
Miyashita Satoshi
Nozue Ikuo
Yamanouchi Akihiro
Chu John S.
Japan Synthetic Rubber Co. Ltd.
LandOfFree
Radiation-sensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Radiation-sensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Radiation-sensitive resin composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1851494