Radiation-sensitive positive working composition and material wi

Details Radiation-sensitive positive working composition and material wi Radiation-sensitive positive working composition and material wi

1985-11-22

1987-10-13

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430165, 430191, 430270, G03C 160, G03C 154

Patent

active

046998675

ABSTRACT:
Disclosed is a radiation-sensitive composition, a recording material prepared therewith, and process therefor. The invention is suitable for the production of printing plates and photoresists. The composition contains a 1,2-quinonediazide or a combination of (1) a compound which, under the action of actinic radiation, forms a strong acid, and (2) a compound which possesses at least one acid-cleavable C--O--C bond, the solubility of which in a liquid developer is increased by the action of acid and, as the binder, a polymer having lateral crosslinking groups of the formula --CH.sub.2 OR, in which R is a hydrogen atom, a lower alkyl group, acyl group or hydroxyalkyl group. After being exposed and developed, the composition can be thermally cured and results in an image stencil exhibiting a clean background.

REFERENCES:
patent: 3697274 (1972-10-01), Herrmann
patent: 3900325 (1975-08-01), Christensen et al.
patent: 4164421 (1979-08-01), Shinozaki et al.
patent: 4387152 (1983-06-01), Stahlhofen
patent: 4439516 (1984-03-01), Cernigliaro et al.
patent: 4456679 (1984-06-01), Leyrer et al.
patent: 4572887 (1986-02-01), Geissler
patent: 4581321 (1986-04-01), Stahlhofen
patent: 4642282 (1987-02-01), Stahlhofen
Kirk-Othmer, Encyclopedia of Polymer Science and Technology-vol. 1, (1964), p. 190.
Kirk-Othmer, Encyclopedia of Chemical Technology-vol. 2, (1978), pp. 440-447.
Martin, R. W., The Chemistry of Phenolic Resins-(1956), pp. 17-19.

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